Researchers

FUJITA Takashi

Faculty	Department of Mechanical Engineering / Graduate School of Science and Engineering
Researchmap	https://researchmap.jp/kikai-t.fujita

Manufacturing technology (mechanical, electrical/electronic, chemical engineering) , Manufacturing and production engineering
Manufacturing technology (mechanical, electrical/electronic, chemical engineering) , Manufacturing and production engineering
Manufacturing technology (mechanical, electrical/electronic, chemical engineering) , Electronic devices and equipment

Semiconductor substrate cutting, Pad conditioning, micro-grooving, Chemical-Mechanical Planarization

Precise Control of Wafer Edge Removal Profile in Chemical Mechanical Polishing
Takashi Fujita
ECS Journal of Solid State Science and Technology 15 , 074001-, 26, Jun. 2026 , Refereed
Fine Grooving of Low-k Film Using Poly-Crystalline Diamond Blade
Takashi Fujita; Yasuo Izumi; Junji Watanabe; Haruto Konishi
Materials transactions 67 (4) 23, Jan. 2026 , Refereed
Stable Pad Conditioning Using Bundled Flexible Fibers in Chemical Mechanical Planarization
Takashi Fujita; Yutaro Arai; Michio Uneda
ECS Journal of Solid State Science and Technology 15 , 014006-, 12, Jan. 2026 , Refereed

Ultra-precise and microfabrication process technology for silicon and compound semiconductors - Fundamentals and latest trends in process-specific machining technology - , Chapter 27 , CMC Publishing , Jun. 2024
Latest trends in advanced semiconductor manufacturing processes and miniaturization technology , Chapter 7 Section 4 , Technical Information Association Co., Ltd. , Sep. 2023
Development trends in CMP technology that supports semiconductor device manufacturing , Chapter 3 Section 2 , Science & Technology Co., Ltd. , 30, Aug. 2023

Research on Strain-Free Mirror-Finish Machining Technology for SiC Substrates Using PCD Grinding Wheels , Jun Nishiyama; Takashi Fujita; Haruto Konishi; Tomofumi Sawauchi; Yasuo Izumi; Junji Watanabe , 2026年度砥粒加工学会学術講演会講演論文集(2026) E10 pp.338-339 2026-Nendo toryūkakō gakkai gakujutsu kōen-kai kōenronbunshū (2026) E 10 pp. 338 - 339 43 Proceedings of the 2026 Academic Conference of the Japan Society for Abrasive Technology (2026) E10, pp. 338–339 , 31, Aug. 2026
Investigation of Precision Mirror-Finish Machining Technology for Copper Substrates Using PCD Blades with High-Density Cutting Edges , Tomofumi Sawauchi; Takashi Fujita; Haruto Konishi; Jun Nishiyama; Yasuo Izumi , Proceedings of the 2026 Academic Conference of the Japan Society for Abrasive Technology (2026) E11, pp. 340–341 , 31, Aug. 2026
Effect of Slurry Chemistry on Surface Roughness and Residual Stress in SiC CMP , Ryuu Furukawa; Junji Nagahashi; Souta Matsuno; Takashi Fujita , 2026年度砥粒加工学会学術講演会講演論文集(2026) E12 pp.342-343 , 31, Aug. 2026

Laboratory Introduction Kindai University Advanced Processing Systems Engineering Laboratory , Takashi Fujita , 砥粒加工学会誌 , 68 , 8 , 450 , 450 , Aug. 2024
"Visualization" of Polishing Pad Surface Properties by Flexible Fiber Conditioner and Its Mechanism Consideration , Michio Uneda; Takashi Fujita; Yutaro Arai , Journal of the Japan Society for Abrasive Technology , 67 , 2 , 71 , 74 , Feb. 2023
革新的な微細精密加工技術の開発を目指して , 藤田隆 , 精密工学会誌 , 88 , 887 , 566 , 567 , Jul. 2022

Crack propagation device and crack propagation method , Tasuku Shimizu, Shuhei Oshida, Akira Uekihara, Takashi Fujita
亀裂進展方法 , 押田修平, 清水翼, 藤田隆, 植木原明 , 特許7898502
Crack propagation device and crack propagation method , Shuhei Oshida, Tasuku Shimizu, Takashi Fujita, Akira Uekihara , 特許7617357

Nov. 2024, Japan Society for Precision Engineering Autumn Meeting, Best Presentation Award
Jun. 2024, Machine Tool Technology Promotion Foundation, Machine Tool Technology Promotion Award/Encouragement Award
May. 2024, Mazak Foundation, Advanced Manufacturing Systems Outstanding Paper Award

Kinki Bureau of Economy, Trade and Industry, Ministry of Economy, Trade and Industry, FY2020 growth-type small and medium-sized enterprises, etc. research and development support project (GoTech project), Research and development of a bending stress concentration cleavage system to achieve high-quality individual wafer fragmentation of high-hardness wafers for next-generation power semiconductors. , Shin Nippon Tech Co., Ltd., Kindai University
Osawa Foundation for the Promotion of Science and Technology R&D Grant, Osawa Foundation for the Promotion of Science and Technology R&D Grant, Development of Mirror-Finish Grinding Technology for SiC Substrate Surfaces Using PCD Constant-Pressure High-Density Cutting-Edge Tools
工作機械における新しい加工液塗布供給システムの開発