Researchers

SHISHIDO Nobuyuki

SHISHIDO Nobuyuki
Associate Professor
Faculty Department of Mechanical Engineering / Graduate School of Science and Engineering
Researchmap https://researchmap.jp/7000010791

Education and Career

Academic & Professional Experience

  • Apr. 2024 , Kindai University Faculty of Science and Engineering Department of Mechanical Engineering 准教授
  • Apr. 2020 - Mar. 2024 , Kindai University Faculty of Science and Engineering Department of Mechanical Engineering 講師
  • Feb. 2016 - Mar. 2020 , Kyushu Institute of Technology Power Electronics 客員准教授
  • Oct. 2015 - Mar. 2020 , Green Electronics Research Institute, Kitakyushu PE信頼性研究室 Research Associate Professor
  • Oct. 2015 - Mar. 2017 , Nagoya Institute of Technology 大学院しくみ領域 産学官連携研究員
  • Apr. 2010 - Sep. 2015 , Nagoya Institute of Technology

Research Activities

Research Areas

  • Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Machine materials and mechanics

Research Interests

電子実装, 信頼性設計, 破壊力学, 材料力学

Published Papers

  1. Effect of the location of voids in solder joints on the power cycling lifetime of power semiconductor packages
    Hiroshi Onodera; Nobuyuki Shishido; Daisuke Asari; Hiroshi Isono; Wataru Saito
    Power Electronic Devices and Components  14  , 100142-100142, Jun. 2026  , Refereed
  2. Application of Nonlinear Fracture Mechanics Parameter Δ T * to Estimating Wire-Liftoff Lifetime: Effect of Creep Constitutive Equations
    Nobuyuki Shishido; Yutaka Hayama; Saya Okamoto; Yusuke Shigyo; Shinya Taketomi; Masaaki Koganemaru; Seiya Hagihara; Noriyuki Miyazaki
    IEEE Transactions on Components, Packaging and Manufacturing Technology  , 1-1, 2026  , Refereed
  3. Wire-Liftoff Lifetime Estimation Based on Thermal Fatigue Crack Growth: Proposal of Estimation Methodology Using Nonlinear Fracture Mechanics Parameter ΔT*
    Nobuyuki Shishido; Yuki Akinaga; Shohei Jitsuyama; Seiya Hagihara; Yutaka Hayama; Shinya Taketomi; Masaaki Koganemaru; Noriyuki Miyazaki
    Journal of The Japan Institute of Electronics Packaging  29  (1)  , 102-113, Jan. 2026  , Refereed

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MISC

  1. パワー半導体パッケージにおけるはんだ接合ボイド変動がパワーサイクル寿命に及ぼす影響—Effect of Solder Junction Void Variation in Power Semiconductor Package on Power Cycle Lifetime—電子デバイス/半導体電力変換合同研究会・パワーデバイス・電力変換器とその制御 , 小野寺 浩; 浅利 太輔; 磯野 浩; 宍戸 信之; 齋藤 渉 , 電気学会研究会資料. SPC = The papers of technical meeting on semiconductor power converter, IEE Japan / 半導体電力変換研究会 [編] , 2024 , 178-194 , 47 , 52 , 14, Nov. 2024
  2. Mate2023 トクシュウゴウ : ダイ29カイ 「 エレクトロニクス ニ オケル マイクロ セツゴウ ・ ジッソウ ギジュツ 」 シンポジウム , 苅谷 健人; 宍戸 信之; 尾崎 仁哉; 浮田 昌也; 中原 健 , スマートプロセス学会誌 = Journal of smart processing , 12 , 5 , 251 , 256 , Sep. 2023
  3. チョッパ回路連続動作時におけるIGBTのV[CE(sat)]と温度プロファイルの測定—Experimental measurement of V[CE(sat)] and temperature profile in an IGBT during continuous chopper circuit operation—電力技術/電力系統技術/半導体電力変換 合同研究会 電力技術一般ならびに半導体電力変換一般 , 原 幹太; 長谷川 一徳; 宍戸 信之; 齋藤 渉; 二宮 保 , 電気学会研究会資料. PSE = The papers of Technical Meeting on "Power Systems Engineering", IEE Japan / 電力系統技術研究会 [編] , 2023 , 76-98 , 37 , 42 , 7, Mar. 2023

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Patents

  1. 金属配線構造及び金属配線形成方法 , 宍戸信之, 武富紳也 , 特許6912054
  2. 金属配線と絶縁層との密着強度の改善する方法 , 佐藤 尚, 宍戸 信之, 西田 政弘, 神谷 庄司
  3. 剪断剥離試験による界面強度の評価方法。 , 神谷 庄司, 宍戸 信之

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Awards & Honors

  1. Oct. 2025, IEC, 1906 Award
  2. Feb. 2017, スマートプロセス学会, Mate2017奨励賞
  3. Dec. 2016, 日本機械学会マイクロ・ナノ工学部門, 優秀講演論文賞

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Research Grants & Projects

  1. Japan Society for the Promotion of Science, Grants-in-Aid for Scientific Research, Development of evaluation and control method for local fluctuation of thermal characteristics near lattice defects , Saga University
  2. Japan Society for the Promotion of Science, Grants-in-Aid for Scientific Research, Detection of potential defects on small-scale interfacial structures , 北九州市環境エレクトロニクス研究所
  3. Japan Society for the Promotion of Science, Grants-in-Aid for Scientific Research Grant-in-Aid for Young Scientists (B), Qualitative evaluation for the diversity of interface strength due to fcc crystalline structure , Nagoya Institute of Technology

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